TY - JOUR
T1 - SPICE Modeling of Memristive Devices-Based Neural Networks
AU - Aguirre, F. L.
AU - Sune, J.
AU - Miranda, E.
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - This paper reports a SPICE-based framework for circuit-level simulation of hybrid memristor/CMOS neural networks. By relying on ex-situ training, our approach systematizes the circuital representation of a neural network given a set of high-level design parameters. As a key element of simulations, we put special emphasis on the use of a recently developed compact model to represent the electrical characteristics of memristors. The model is called the Dynamic Memdiode Model (DMM) and is based on L. Chua's theory for memristive devices. The model comprises two equations: one equation for the electron transport and one equation for the displacement of metal ions or oxygen vacancies caused by the application of the external electric field. We show how the proposed simulation framework allows to assess the influence of the circuit parasitics as well as the device non-idealities on the performance metrics of neural networks.
AB - This paper reports a SPICE-based framework for circuit-level simulation of hybrid memristor/CMOS neural networks. By relying on ex-situ training, our approach systematizes the circuital representation of a neural network given a set of high-level design parameters. As a key element of simulations, we put special emphasis on the use of a recently developed compact model to represent the electrical characteristics of memristors. The model is called the Dynamic Memdiode Model (DMM) and is based on L. Chua's theory for memristive devices. The model comprises two equations: one equation for the electron transport and one equation for the displacement of metal ions or oxygen vacancies caused by the application of the external electric field. We show how the proposed simulation framework allows to assess the influence of the circuit parasitics as well as the device non-idealities on the performance metrics of neural networks.
UR - http://www.scopus.com/inward/record.url?scp=85183795097&partnerID=8YFLogxK
U2 - 10.1109/MIEL58498.2023.10315949
DO - 10.1109/MIEL58498.2023.10315949
M3 - Article
AN - SCOPUS:85183795097
JO - 2023 IEEE 33rd International Conference on Microelectronics, MIEL 2023
JF - 2023 IEEE 33rd International Conference on Microelectronics, MIEL 2023
ER -