CMOS-SOI platform for monolithic integration of crystalline silicon MEMS

M. Villarroya; E. Figueras; J. Verd; J. Teva; G. Abadal; F. Pérez-Murano; J. Montserrat; A. Uranga; J. Esteve; N. Barniol

doi:10.1049/el:20061097

CMOS-SOI platform for monolithic integration of crystalline silicon MEMS

M. Villarroya, E. Figueras, J. Verd, J. Teva, G. Abadal, F. Pérez-Murano, J. Montserrat, A. Uranga, J. Esteve, N. Barniol

Departamento de Ingeniería Electrónica

Producción científica: Contribución a una revista › Artículo › Investigación › revisión exhaustiva

1 Cita (Scopus)

Resumen

A new platform for the fabrication of crystalline micro- and nano-electromechanical systems fully integrable with CMOS is presented. A pre-CMOS process on SOI wafers allows bulk silicon areas for standard CMOS processing and areas with a stack layer of silicon and silicon oxide to be obtained, in which a set of microelectromechanical devices can be fabricated. An integrated resonant beam system with electrical actuation and detection fabricated according to the presented approach is provided.

Idioma original	Inglés
Páginas (desde-hasta)	800-801
Número de páginas	2
Publicación	Electronics Letters
Volumen	42
N.º	14
DOI	https://doi.org/10.1049/el:20061097
Estado	Publicada - 6 jul 2006

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abstract = "A new platform for the fabrication of crystalline micro- and nano-electromechanical systems fully integrable with CMOS is presented. A pre-CMOS process on SOI wafers allows bulk silicon areas for standard CMOS processing and areas with a stack layer of silicon and silicon oxide to be obtained, in which a set of microelectromechanical devices can be fabricated. An integrated resonant beam system with electrical actuation and detection fabricated according to the presented approach is provided.",

author = "M. Villarroya and E. Figueras and J. Verd and J. Teva and G. Abadal and F. P{\'e}rez-Murano and J. Montserrat and A. Uranga and J. Esteve and N. Barniol",

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AU - Villarroya, M.

AU - Figueras, E.

AU - Verd, J.

AU - Teva, J.

AU - Abadal, G.

AU - Pérez-Murano, F.

AU - Montserrat, J.

AU - Uranga, A.

AU - Esteve, J.

AU - Barniol, N.

PY - 2006/7/6

Y1 - 2006/7/6

N2 - A new platform for the fabrication of crystalline micro- and nano-electromechanical systems fully integrable with CMOS is presented. A pre-CMOS process on SOI wafers allows bulk silicon areas for standard CMOS processing and areas with a stack layer of silicon and silicon oxide to be obtained, in which a set of microelectromechanical devices can be fabricated. An integrated resonant beam system with electrical actuation and detection fabricated according to the presented approach is provided.

AB - A new platform for the fabrication of crystalline micro- and nano-electromechanical systems fully integrable with CMOS is presented. A pre-CMOS process on SOI wafers allows bulk silicon areas for standard CMOS processing and areas with a stack layer of silicon and silicon oxide to be obtained, in which a set of microelectromechanical devices can be fabricated. An integrated resonant beam system with electrical actuation and detection fabricated according to the presented approach is provided.

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DO - 10.1049/el:20061097

M3 - Article

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VL - 42

SP - 800

EP - 801

JO - Electronics Letters

JF - Electronics Letters

IS - 14

ER -

CMOS-SOI platform for monolithic integration of crystalline silicon MEMS

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