Skip to main navigation Skip to search Skip to main content

Wafer level packaging of silicon pressure sensors

H. Krassow, F. Campabadal, E. Lora-Tamayo

    Research output: Contribution to journal › Article › Research › peer-review

    25   Link opens in a new tab Citations (Scopus)

    Fingerprint

    Dive into the research topics of 'Wafer level packaging of silicon pressure sensors'. Together they form a unique fingerprint.
    Sort by

    Keyphrases

    Engineering

    Material Science