Temperature-dependent transition to progressive breakdown in thin silicon dioxide based gate dielectrics

Jordi Suñé, Ernest Y. Wu

Research output: Contribution to journalArticleResearchpeer-review

5 Citations (Scopus)


The transition between well-defined soft and hard breakdown modes to progressive breakdown in ultrathin silicon dioxide based dielectrics is studied by means of the statistics of residual time (the time from first breakdown to device failure). By stressing metal-oxide-semiconductor test capacitors with an oxide thickness of 2.2 nm under different gate bias and temperatures, it is demonstrated that low voltages and temperatures favor stable hard and soft breakdown modes, while high temperatures and voltages lead to a progressive breakdown controlled regime. Our results support the idea that no significant change of the involved physics occurs in the transition from one breakdown regime to the other. The continuous transition from one regime to the other permits one to clearly identify progressive breakdown as hard breakdown, which always requires a certain time to reach the device failure conditions. © 2005 American Institute of Physics.
Original languageEnglish
Article number193502
Pages (from-to)1-3
JournalApplied physics letters
Publication statusPublished - 9 May 2005


Dive into the research topics of 'Temperature-dependent transition to progressive breakdown in thin silicon dioxide based gate dielectrics'. Together they form a unique fingerprint.

Cite this