Abstract
© 2018 Institute of Electrical and Electronics Engineers Inc. All rights reserved. Resistiveswitchingmemory (RRAM) is among the most mature technologies for next generation storage class memory with low power, high density, and improved performance. The biggest challenge toward industrialization of RRAM is the large variability and noise issues, causing distribution broadening which affects retention even at room temperature. Noise and variability can be addressedby enlarging the resistancewindowbetween lowresistance state and high-resistance state, which requires a proper engineering of device materials and electrodes. This paper presents an RRAM device technology based on silicon oxide (SiOx), showing high resistance window thanks to the high bandgap in the silicon oxide. Endurance, retention, and variability show excellent performance, thus supporting SiOx as a strong active material for developing future generation RRAMs.
Original language | English |
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Pages (from-to) | 115-121 |
Journal | IEEE Transactions on Electron Devices |
Volume | 65 |
Issue number | 1 |
DOIs | |
Publication status | Published - 1 Jan 2018 |
Keywords
- Cross point array
- Memory reliability
- Nonvolatile memory technology
- Resistive switching memory (RRAM)
- Silicon oxide
- Storage class memory (SCM)