Reliability evaluation of a silicon-on-silicon MCM-D package

J. Barton, G. McCarthy, R. Doyle, K. Delaney, E. Cabruja, M. Lozano, A. Collado, J. Santander

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    2 Citations (Scopus)

    Abstract

    This paper presents the results of reliability testing on a multichip module technology with active silicon substrates. The modules use flip-chip technology to attach silicon chips to the active substrate and this assembly is then packaged into a plastic ball grid array package. Performance was evaluated using two custom designed test chips incorporating thermal, thermomechanical, electrical and reliability test structures. A rigorous environmental test sequence including temperature, cycling, humidity, highly accelerated stress test and power cycling were carried out on the demonstrators. A full destructive physical analysis was then performed, consisting of die/substrate shear, wire bond pull tests and microsectioning. © 2001 Elsevier Science Ltd.
    Original languageEnglish
    Pages (from-to)887-899
    JournalMicroelectronics Reliability
    Volume41
    Issue number6
    DOIs
    Publication statusPublished - 1 Jan 2001

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