Proceedings of the 3rd European Conference on Electronic Packaging Technology: "SUMMIT: Silicon Substrate Multichip Modules for Innovative Products: 3rd European Conference on Electronic Packaging Technology

E. Cabruja, A. Collado, M. Lozano, M. Zabala, J. Santander, J. Cazalla, - (Editor)

    Research output: Book/ReportProceedingResearch

    Original languageUndefined/Unknown
    Place of PublicationNüremberg (DE)
    Number of pages1
    Publication statusPublished - Jun 1998

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