Photocurable polymers applied as encapsulating materials for ISFET production

A. Bratov, J. Muñoz, C. Dominguez, J. Bartrolí

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Abstract

Promising materials for semiconductor-based chemical sensors are photocurable polymers that can be applied utilizing conventional photolithographic processes compatible with microelectronic technology. In this work different acrylate-based polymers curable under UV irradiation have been tested for their applicability as packaging materials. A mixture consisting of acrylate oligomer (epoxy, urethane, siloxane, polyester), reactive monomers and suitable photoinitiator is applied to a wirebonded sensor chip to form a thick (100-1000 μm) polymer layer. After exposure and development, a window is opened over the gate region. Results on polymer-layer adhesion, electrical resistivity, chemical resistance and lifetime of the encapsulated microsensors in various aqueous solutions are presented. © 1995.
Original languageEnglish
Pages (from-to)823-825
JournalSensors and Actuators: B. Chemical
Volume25
Issue number1-3
DOIs
Publication statusPublished - 1 Jan 1995

Keywords

  • ISFETs
  • Photocurable polymers
  • Sensor packaging

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    Bratov, A., Muñoz, J., Dominguez, C., & Bartrolí, J. (1995). Photocurable polymers applied as encapsulating materials for ISFET production. Sensors and Actuators: B. Chemical, 25(1-3), 823-825. https://doi.org/10.1016/0925-4005(95)85183-6