Photocurable polymers applied as encapsulating materials for ISFET production

A. Bratov, J. Muñoz, C. Dominguez, J. Bartrolí

Research output: Contribution to journalArticleResearchpeer-review

49 Citations (Scopus)


Promising materials for semiconductor-based chemical sensors are photocurable polymers that can be applied utilizing conventional photolithographic processes compatible with microelectronic technology. In this work different acrylate-based polymers curable under UV irradiation have been tested for their applicability as packaging materials. A mixture consisting of acrylate oligomer (epoxy, urethane, siloxane, polyester), reactive monomers and suitable photoinitiator is applied to a wirebonded sensor chip to form a thick (100-1000 μm) polymer layer. After exposure and development, a window is opened over the gate region. Results on polymer-layer adhesion, electrical resistivity, chemical resistance and lifetime of the encapsulated microsensors in various aqueous solutions are presented. © 1995.
Original languageEnglish
Pages (from-to)823-825
JournalSensors and Actuators: B. Chemical
Issue number1-3
Publication statusPublished - 1 Jan 1995


  • ISFETs
  • Photocurable polymers
  • Sensor packaging


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