Promising materials for semiconductor-based chemical sensors are photocurable polymers that can be applied utilizing conventional photolithographic processes compatible with microelectronic technology. In this work different acrylate-based polymers curable under UV irradiation have been tested for their applicability as packaging materials. A mixture consisting of acrylate oligomer (epoxy, urethane, siloxane, polyester), reactive monomers and suitable photoinitiator is applied to a wirebonded sensor chip to form a thick (100-1000 μm) polymer layer. After exposure and development, a window is opened over the gate region. Results on polymer-layer adhesion, electrical resistivity, chemical resistance and lifetime of the encapsulated microsensors in various aqueous solutions are presented. © 1995.
|Journal||Sensors and Actuators: B. Chemical|
|Publication status||Published - 1 Jan 1995|
- Photocurable polymers
- Sensor packaging
Bratov, A., Muñoz, J., Dominguez, C., & Bartrolí, J. (1995). Photocurable polymers applied as encapsulating materials for ISFET production. Sensors and Actuators: B. Chemical, 25(1-3), 823-825. https://doi.org/10.1016/0925-4005(95)85183-6