On the properties of conducting filament in ReRAM

Xiaojuan Lian, M. Lanza, A. Rodriguez, E. Miranda, J. Suñe

Research output: Chapter in Book › Chapter › Research

Original language	English
Title of host publication	Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
Place of Publication	Nova York (US)
Pages	-
Edition	1
Publication status	Published - 1 Jan 2014

Cite this

Lian, X., Lanza, M., Rodriguez, A., Miranda, E., & Suñe, J. (2014). On the properties of conducting filament in ReRAM. In Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on (1 ed., pp. -).

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title = "On the properties of conducting filament in ReRAM",

author = "Xiaojuan Lian and M. Lanza and A. Rodriguez and E. Miranda and J. Su{\~n}e",

year = "2014",

month = jan,

day = "1",

language = "English",

isbn = "978-1-4799-3296-2",

pages = "--",

booktitle = "Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on",

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}