On the properties of conducting filament in ReRAM

Xiaojuan Lian, M. Lanza, A. Rodriguez, E. Miranda, J. Suñe

Research output: Chapter in BookChapterResearch

Original languageEnglish
Title of host publicationSolid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
Place of PublicationNova York (US)
Pages-
Edition1
Publication statusPublished - 1 Jan 2014

Cite this

Lian, X., Lanza, M., Rodriguez, A., Miranda, E., & Suñe, J. (2014). On the properties of conducting filament in ReRAM. In Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on (1 ed., pp. -).