Novel SU-8 based vacuum wafer-level packaging for MEMS devices

Gonzalo Murillo; Zachary J. Davis; Stephan Keller; Gabriel Abadal; Jordi Agusti; Alberto Cagliani; Nadine Noeth; Anja Boisen; Nuria Barniol

doi:https://doi.org/10.1016/j.mee.2009.12.048

Novel SU-8 based vacuum wafer-level packaging for MEMS devices

Gonzalo Murillo, Zachary J. Davis, Stephan Keller, Gabriel Abadal, Jordi Agusti, Alberto Cagliani, Nadine Noeth, Anja Boisen, Nuria Barniol

Research output: Contribution to journal › Article › Research › peer-review

21 Citations (Scopus)

Abstract

This work presents a simple and low-cost SU-8 based wafer-level vacuum packaging method which is CMOS and MEMS compatible. Different approaches have been investigated by taking advantage of the properties of SU-8, such as chemical resistance, optical transparence, mechanical reliability and versatility. A novel technique of wafer level adhesive bonding, which uses SU-8 as structural and adhesive material, has been developed and successfully demonstrated. Optical inspection and SEM images were used in order to measure the package lid bending and probe the encapsulation sealing. In addition, an indirect vacuum level measurement has been carried out by comparing the different quality factors of a test cantilever resonator when this element is packed or unpacked. © 2009 Elsevier B.V. All rights reserved.

Original language	English
Pages (from-to)	1173-1176
Journal	Microelectronic Engineering
Volume	87
DOIs	https://doi.org/10.1016/j.mee.2009.12.048
Publication status	Published - 1 May 2010

Keywords

MEMS
SU-8
Vacuum packaging
Wafer-level packaging

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https://doi.org/10.1016/j.mee.2009.12.048

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title = "Novel SU-8 based vacuum wafer-level packaging for MEMS devices",

abstract = "This work presents a simple and low-cost SU-8 based wafer-level vacuum packaging method which is CMOS and MEMS compatible. Different approaches have been investigated by taking advantage of the properties of SU-8, such as chemical resistance, optical transparence, mechanical reliability and versatility. A novel technique of wafer level adhesive bonding, which uses SU-8 as structural and adhesive material, has been developed and successfully demonstrated. Optical inspection and SEM images were used in order to measure the package lid bending and probe the encapsulation sealing. In addition, an indirect vacuum level measurement has been carried out by comparing the different quality factors of a test cantilever resonator when this element is packed or unpacked. {\textcopyright} 2009 Elsevier B.V. All rights reserved.",

keywords = "MEMS, SU-8, Vacuum packaging, Wafer-level packaging",

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doi = "https://doi.org/10.1016/j.mee.2009.12.048",

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TY - JOUR

T1 - Novel SU-8 based vacuum wafer-level packaging for MEMS devices

AU - Murillo, Gonzalo

AU - Davis, Zachary J.

AU - Keller, Stephan

AU - Abadal, Gabriel

AU - Agusti, Jordi

AU - Cagliani, Alberto

AU - Noeth, Nadine

AU - Boisen, Anja

AU - Barniol, Nuria

PY - 2010/5/1

Y1 - 2010/5/1

N2 - This work presents a simple and low-cost SU-8 based wafer-level vacuum packaging method which is CMOS and MEMS compatible. Different approaches have been investigated by taking advantage of the properties of SU-8, such as chemical resistance, optical transparence, mechanical reliability and versatility. A novel technique of wafer level adhesive bonding, which uses SU-8 as structural and adhesive material, has been developed and successfully demonstrated. Optical inspection and SEM images were used in order to measure the package lid bending and probe the encapsulation sealing. In addition, an indirect vacuum level measurement has been carried out by comparing the different quality factors of a test cantilever resonator when this element is packed or unpacked. © 2009 Elsevier B.V. All rights reserved.

AB - This work presents a simple and low-cost SU-8 based wafer-level vacuum packaging method which is CMOS and MEMS compatible. Different approaches have been investigated by taking advantage of the properties of SU-8, such as chemical resistance, optical transparence, mechanical reliability and versatility. A novel technique of wafer level adhesive bonding, which uses SU-8 as structural and adhesive material, has been developed and successfully demonstrated. Optical inspection and SEM images were used in order to measure the package lid bending and probe the encapsulation sealing. In addition, an indirect vacuum level measurement has been carried out by comparing the different quality factors of a test cantilever resonator when this element is packed or unpacked. © 2009 Elsevier B.V. All rights reserved.

KW - MEMS

KW - SU-8

KW - Vacuum packaging

KW - Wafer-level packaging

U2 - https://doi.org/10.1016/j.mee.2009.12.048

DO - https://doi.org/10.1016/j.mee.2009.12.048

M3 - Article

SN - 0167-9317

VL - 87

SP - 1173

EP - 1176

JO - Microelectronic Engineering

JF - Microelectronic Engineering

ER -

Novel SU-8 based vacuum wafer-level packaging for MEMS devices

Abstract

Keywords

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