Novel SU-8 based vacuum wafer-level packaging for MEMS devices

Gonzalo Murillo, Zachary J. Davis, Stephan Keller, Gabriel Abadal, Jordi Agusti, Alberto Cagliani, Nadine Noeth, Anja Boisen, Nuria Barniol

Research output: Contribution to journalArticleResearchpeer-review

21 Citations (Scopus)


This work presents a simple and low-cost SU-8 based wafer-level vacuum packaging method which is CMOS and MEMS compatible. Different approaches have been investigated by taking advantage of the properties of SU-8, such as chemical resistance, optical transparence, mechanical reliability and versatility. A novel technique of wafer level adhesive bonding, which uses SU-8 as structural and adhesive material, has been developed and successfully demonstrated. Optical inspection and SEM images were used in order to measure the package lid bending and probe the encapsulation sealing. In addition, an indirect vacuum level measurement has been carried out by comparing the different quality factors of a test cantilever resonator when this element is packed or unpacked. © 2009 Elsevier B.V. All rights reserved.
Original languageEnglish
Pages (from-to)1173-1176
JournalMicroelectronic Engineering
Publication statusPublished - 1 May 2010


  • MEMS
  • SU-8
  • Vacuum packaging
  • Wafer-level packaging


Dive into the research topics of 'Novel SU-8 based vacuum wafer-level packaging for MEMS devices'. Together they form a unique fingerprint.

Cite this