Abstract
In this work, a quantitative analysis is applied to resolve the newly reported polarity-dependent charge-to-breakdown (QBD) data from thick oxides of 6.8 nm down to ultrathin oxides of 1.9 nm. Three independent sets of QBD data, i.e., n+poly/NFET stressed under inversion and accumulation, and p+poly/PFET under accumulation are carefully investigated. The QBD degradation observed for p-type anodes, either poly-Si or Si-substrate, can be nicely understood with the framework of maximum energy released by injected electrons. Thus, this work provides a universal and quantitative account for a variety of experimental observations in the time-to-breakdown (TBD) and QBD polarity-dependence of oxide breakdown.
Original language | English |
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Pages (from-to) | 494-496 |
Journal | IEEE Electron Device Letters |
Volume | 23 |
DOIs | |
Publication status | Published - 1 Aug 2002 |
Keywords
- Gate dielectric
- MOS devices
- Oxide
- Reliability
- Semiconductor device reliability
- TDDB measurements