Methodology for the Simulation of the Variability of MOSFETs with Polycrystalline High-k Dielectrics Using CAFM Input Data

A. Ruiz*, C. Couso, N. Seoane, M. Porti, A. J. Garcia-Loureiro, M. Nafria

*Corresponding author for this work

Research output: Contribution to journalArticleResearchpeer-review

1 Citation (Scopus)
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Abstract

In this work, a simulation methodology, whose inputs are Conductive Atomic Force Microscope (CAFM) experimental data, is proposed to evaluate the impact of nanoscale variability sources related to the polycrystallization of high-k dielectrics (i.e., oxide thickness, tox, and charge density, $\rho _{\mathrm {ox}}$ , fluctuations in the nanometer range) on the Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET) variability. To simulate this variability, a Thickness And Charge MAp Generator (TACMAG) has been developed and used in combination with an in-house-built 3D device simulator (VENDES). From CAFM experimental data (topography and current) obtained on a small area of a given polycrystalline dielectric, the TACMAG generates a high amount of tox and $\rho _{\mathrm {ox}}$ configurations of the gate dielectric, with identical statistical characteristics to those experimentally measured. These dielectrics are then introduced into the device simulator, with which the impact of the tox and $\rho _{\mathrm {ox}}$ fluctuations in the dielectric on the variability of MOSFETs (i.e., threshold voltage) is analyzed. Finally, the impact of different nanoscale parameters, such as the Grain size and Grain Boundaries depth (of polycrystalline dielectrics) on such variability has been evaluated.

Original languageEnglish
Article number9462835
Pages (from-to)90568-90576
Number of pages9
JournalIEEE Access
Volume9
DOIs
Publication statusPublished - 2021

Keywords

  • 3D device simulations
  • CAFM
  • defect density
  • high-k
  • MOSFET variability
  • polycrystalline dielectric

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