In this work we study the feasibility to obtain the smallest CMOS-NEMS resonator using a sub-100 nm CMOS technology. The NEMS resonators are defined in a top-down approach using the available layers of the 65 nm CMOS technology from ST Microelectronics. A combination of dry and wet etching is developed in order to release the NEMS in an in-house post-CMOS process. Two different NEMS resonators are designed: 60 nm × 100 nm polysilicon and 90 nm × 180 nm copper clamped-clamped beams. The designed polysilicon CC Beam with a length of 1.5 lm, resonates at 232 MHz and is capable to provide the same mass sensitivity than a bottom-up silicon nanowire. © 2013 Elsevier B.V. All rights reserved.
- Mass sensor
- Releasing process