Improving silicon integrated antennas by substrate micromachining: A study of etching patterns

J. Gemio; J. Parron; P. de Paco; J. Sacristan; A. Baldi

doi:https://doi.org/10.2528/PIER11050501

Improving silicon integrated antennas by substrate micromachining: A study of etching patterns

J. Gemio, J. Parron, P. de Paco, J. Sacristan, A. Baldi

Research output: Contribution to journal › Article › Research › peer-review

3 Citations (Scopus)

Abstract

One of the main drawbacks of antenna integration on standard CMOS silicon substrates are the low radiation efficiency levels obtained due to the high silicon losses. This paper studies the use of micromachining techniques to remove silicon beneath the antenna as a solution to improve radiation efficiency. Several etching patterns are analyzed for different etching depths through simulations and measurements in order to find out which are the best ones for the micromachining process. Results are verified in two operating scenarios.

Original language	English
Pages (from-to)	365-378
Journal	Progress in Electromagnetics Research
Volume	117
DOIs	https://doi.org/10.2528/PIER11050501
Publication status	Published - 1 Jan 2011

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title = "Improving silicon integrated antennas by substrate micromachining: A study of etching patterns",

abstract = "One of the main drawbacks of antenna integration on standard CMOS silicon substrates are the low radiation efficiency levels obtained due to the high silicon losses. This paper studies the use of micromachining techniques to remove silicon beneath the antenna as a solution to improve radiation efficiency. Several etching patterns are analyzed for different etching depths through simulations and measurements in order to find out which are the best ones for the micromachining process. Results are verified in two operating scenarios.",

author = "J. Gemio and J. Parron and {de Paco}, P. and J. Sacristan and A. Baldi",

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AU - de Paco, P.

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AU - Baldi, A.

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N2 - One of the main drawbacks of antenna integration on standard CMOS silicon substrates are the low radiation efficiency levels obtained due to the high silicon losses. This paper studies the use of micromachining techniques to remove silicon beneath the antenna as a solution to improve radiation efficiency. Several etching patterns are analyzed for different etching depths through simulations and measurements in order to find out which are the best ones for the micromachining process. Results are verified in two operating scenarios.

AB - One of the main drawbacks of antenna integration on standard CMOS silicon substrates are the low radiation efficiency levels obtained due to the high silicon losses. This paper studies the use of micromachining techniques to remove silicon beneath the antenna as a solution to improve radiation efficiency. Several etching patterns are analyzed for different etching depths through simulations and measurements in order to find out which are the best ones for the micromachining process. Results are verified in two operating scenarios.

U2 - https://doi.org/10.2528/PIER11050501

DO - https://doi.org/10.2528/PIER11050501

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EP - 378

JO - Progress in Electromagnetics Research

JF - Progress in Electromagnetics Research

SN - 1070-4698

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