Hot-spot detection in integrated circuits by substrate heat-flux sensing

X. Perpiñà; J. Altet; X. Jordà; M. Vellvehi; J. Millán; N. Mestres

doi:10.1109/LED.2008.2002751

Hot-spot detection in integrated circuits by substrate heat-flux sensing

X. Perpiñà, J. Altet, X. Jordà, M. Vellvehi, J. Millán, N. Mestres

Research output: Contribution to journal › Article › Research › peer-review

18 Citations (Scopus)

Abstract

This letter presents a novel approach to detect hot spots (HSs) in active integrated circuits (ICs) and devices. It is based on sensing the HS heat flux within the chip substrate with a probe-laser beam. As the beam passes through the die, it experiences a deflection directly proportional to the heat flux found along its trajectory (internal infrared laser deflection technique). The proposed strategy allows inspecting the chip through its lateral sides (lateral access), avoiding the metal and passivation layers placed over the die. The obtained results demonstrate the suitability of this technique to locate and characterize devices behaving as hot spots in nowadays IC CMOS technologies. © 2008 IEEE.

Original language	English
Pages (from-to)	1142-1144
Journal	IEEE Electron Device Letters
Volume	29
Issue number	10
DOIs	https://doi.org/10.1109/LED.2008.2002751
Publication status	Published - 11 Sep 2008

Keywords

Device thermal characterization
Hot-spot (HS) detection
Integrated circuit (IC) testing
Substrate heat-flux sensing

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10.1109/LED.2008.2002751

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abstract = "This letter presents a novel approach to detect hot spots (HSs) in active integrated circuits (ICs) and devices. It is based on sensing the HS heat flux within the chip substrate with a probe-laser beam. As the beam passes through the die, it experiences a deflection directly proportional to the heat flux found along its trajectory (internal infrared laser deflection technique). The proposed strategy allows inspecting the chip through its lateral sides (lateral access), avoiding the metal and passivation layers placed over the die. The obtained results demonstrate the suitability of this technique to locate and characterize devices behaving as hot spots in nowadays IC CMOS technologies. {\textcopyright} 2008 IEEE.",

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AU - Altet, J.

AU - Jordà, X.

AU - Vellvehi, M.

AU - Millán, J.

AU - Mestres, N.

PY - 2008/9/11

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AB - This letter presents a novel approach to detect hot spots (HSs) in active integrated circuits (ICs) and devices. It is based on sensing the HS heat flux within the chip substrate with a probe-laser beam. As the beam passes through the die, it experiences a deflection directly proportional to the heat flux found along its trajectory (internal infrared laser deflection technique). The proposed strategy allows inspecting the chip through its lateral sides (lateral access), avoiding the metal and passivation layers placed over the die. The obtained results demonstrate the suitability of this technique to locate and characterize devices behaving as hot spots in nowadays IC CMOS technologies. © 2008 IEEE.

KW - Device thermal characterization

KW - Hot-spot (HS) detection

KW - Integrated circuit (IC) testing

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Hot-spot detection in integrated circuits by substrate heat-flux sensing

Abstract

Keywords

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