Abstract
This letter presents a novel approach to detect hot spots (HSs) in active integrated circuits (ICs) and devices. It is based on sensing the HS heat flux within the chip substrate with a probe-laser beam. As the beam passes through the die, it experiences a deflection directly proportional to the heat flux found along its trajectory (internal infrared laser deflection technique). The proposed strategy allows inspecting the chip through its lateral sides (lateral access), avoiding the metal and passivation layers placed over the die. The obtained results demonstrate the suitability of this technique to locate and characterize devices behaving as hot spots in nowadays IC CMOS technologies. © 2008 IEEE.
| Original language | English |
|---|---|
| Pages (from-to) | 1142-1144 |
| Journal | IEEE Electron Device Letters |
| Volume | 29 |
| Issue number | 10 |
| DOIs | |
| Publication status | Published - 11 Sep 2008 |
Keywords
- Device thermal characterization
- Hot-spot (HS) detection
- Integrated circuit (IC) testing
- Substrate heat-flux sensing
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Cite this
Perpiñà, X., Altet, J., Jordà, X., Vellvehi, M., Millán, J., & Mestres, N. (2008). Hot-spot detection in integrated circuits by substrate heat-flux sensing. IEEE Electron Device Letters, 29(10), 1142-1144. https://doi.org/10.1109/LED.2008.2002751