TY - JOUR
T1 - High-speed laser marking with diode arrays
AU - Bravo-Montero, Francesc
AU - Castells-Rufas, David
AU - Carrabina, Jordi
N1 - Funding Information:
This research has been funded by Catalan Government projects (Industrial PhD 2015-DI-022, Research groups 2017SGR1624, SDUR-FEDER BASE3D) and by a Spanish Ministry of Science, Innovation and Universities grant (RTI2018-095209-B-C22). We thank Alison Bancroft for reviewing the paper.
Publisher Copyright:
© 2021 Elsevier Ltd
PY - 2022/2/1
Y1 - 2022/2/1
N2 - The creation of visible changes marked onto object surfaces by laser has become an effective way of coding industrial products. Industrial applications for printing solutions drive the demand for higher speed and higher throughput for in-line digital laser marking. Currently, most laser marking equipment is based on a single laser beam with the corresponding sequential processing that culminates in a performance bottleneck which limits printing production line speed to a de facto barrier of 8 m/s. In this paper, we present a system that overcomes this barrier by using a matrix of laser beams controlled by an embedded high-performance computing platform. The industrialized solutions presented in this paper can print images of 50 to 200 dpi resolution on printing substrates widths ranging from 6 mm to 50 mm, at product line speeds of up to 16 m/s. The analysis we have performed suggests that even higher speeds could be achieved by investing in additional laser beams.
AB - The creation of visible changes marked onto object surfaces by laser has become an effective way of coding industrial products. Industrial applications for printing solutions drive the demand for higher speed and higher throughput for in-line digital laser marking. Currently, most laser marking equipment is based on a single laser beam with the corresponding sequential processing that culminates in a performance bottleneck which limits printing production line speed to a de facto barrier of 8 m/s. In this paper, we present a system that overcomes this barrier by using a matrix of laser beams controlled by an embedded high-performance computing platform. The industrialized solutions presented in this paper can print images of 50 to 200 dpi resolution on printing substrates widths ranging from 6 mm to 50 mm, at product line speeds of up to 16 m/s. The analysis we have performed suggests that even higher speeds could be achieved by investing in additional laser beams.
KW - Digital Printing
KW - Diode Lasers
KW - Industrial Control
KW - Industry 4.0
KW - Laser Applications
KW - Laser Diode Arrays (LDA)
KW - Optical fibers
KW - Real-Time Systems
KW - Reconfigurable Architectures
KW - Semiconductor Laser Arrays
UR - http://www.scopus.com/inward/record.url?scp=85115774702&partnerID=8YFLogxK
UR - https://www.mendeley.com/catalogue/247b0c91-103e-3264-ad50-708c090bf6a8/
U2 - 10.1016/j.optlastec.2021.107551
DO - 10.1016/j.optlastec.2021.107551
M3 - Article
AN - SCOPUS:85115774702
VL - 146
JO - Optics and Laser Technology
JF - Optics and Laser Technology
SN - 0030-3992
M1 - 107551
ER -