Original language | English |
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Pages (from-to) | 579-592 |
Journal | Micromachines |
Volume | 9 |
Publication status | Published - 1 Jan 2018 |
High Performance See Saw Torsional CMOS-MEMS Relay using Tungsten VIA Layer
M. Riverola, F. Torres, A. Uranga, N. Barniol
Research output: Contribution to journal › Article › Research