Electroless copper layers: Physical properties and bath composition

E. Julve

Electroless copper layers: Physical properties and bath composition

E. Julve

Research output: Contribution to journal › Article › Research › peer-review

Abstract

Printed circuit boards can be fabricated economically using electrodes catalysed copper plating. A new electroless plating bath is presented. This aqueous bath contains copper sulphate, EDTA, formaldehyde, triethanolamine, glycine and sodium hydroxide. Copper deposits obtained are crack-free, show very good adhesion and range from 5 to 11 percent in elongation and from 30-60 Kg/mm2 in tensile strength. Copper layers of good quality are obtained controlling specially the formaldehyde concentration, which governs the plating rate. Mechanism of catalysed reactions and structure of electroless copper layers are given.

Original language	English
Pages (from-to)	427-430
Journal	Afinidad
Volume	58
Issue number	496
Publication status	Published - 1 Nov 2001

Keywords

Bath composition
Electroless copper
Layers structure
Physical properties

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@article{9004b251e7a2409ea60dc987f7fb6a47,

title = "Electroless copper layers: Physical properties and bath composition",

abstract = "Printed circuit boards can be fabricated economically using electrodes catalysed copper plating. A new electroless plating bath is presented. This aqueous bath contains copper sulphate, EDTA, formaldehyde, triethanolamine, glycine and sodium hydroxide. Copper deposits obtained are crack-free, show very good adhesion and range from 5 to 11 percent in elongation and from 30-60 Kg/mm2 in tensile strength. Copper layers of good quality are obtained controlling specially the formaldehyde concentration, which governs the plating rate. Mechanism of catalysed reactions and structure of electroless copper layers are given.",

keywords = "Bath composition, Electroless copper, Layers structure, Physical properties",

author = "E. Julve",

year = "2001",

month = nov,

day = "1",

language = "English",

volume = "58",

pages = "427--430",

journal = "Afinidad",

issn = "0001-9704",

publisher = "Asociacion de Quimicos del Instituto Quimico de Sarria",

number = "496",

}

TY - JOUR

T1 - Electroless copper layers: Physical properties and bath composition

AU - Julve, E.

PY - 2001/11/1

Y1 - 2001/11/1

N2 - Printed circuit boards can be fabricated economically using electrodes catalysed copper plating. A new electroless plating bath is presented. This aqueous bath contains copper sulphate, EDTA, formaldehyde, triethanolamine, glycine and sodium hydroxide. Copper deposits obtained are crack-free, show very good adhesion and range from 5 to 11 percent in elongation and from 30-60 Kg/mm2 in tensile strength. Copper layers of good quality are obtained controlling specially the formaldehyde concentration, which governs the plating rate. Mechanism of catalysed reactions and structure of electroless copper layers are given.

AB - Printed circuit boards can be fabricated economically using electrodes catalysed copper plating. A new electroless plating bath is presented. This aqueous bath contains copper sulphate, EDTA, formaldehyde, triethanolamine, glycine and sodium hydroxide. Copper deposits obtained are crack-free, show very good adhesion and range from 5 to 11 percent in elongation and from 30-60 Kg/mm2 in tensile strength. Copper layers of good quality are obtained controlling specially the formaldehyde concentration, which governs the plating rate. Mechanism of catalysed reactions and structure of electroless copper layers are given.

KW - Bath composition

KW - Electroless copper

KW - Layers structure

KW - Physical properties

M3 - Article

VL - 58

SP - 427

EP - 430

JO - Afinidad

JF - Afinidad

SN - 0001-9704

IS - 496

ER -