Abstract
Printed circuit boards can be fabricated economically using electrodes catalysed copper plating. A new electroless plating bath is presented. This aqueous bath contains copper sulphate, EDTA, formaldehyde, triethanolamine, glycine and sodium hydroxide. Copper deposits obtained are crack-free, show very good adhesion and range from 5 to 11 percent in elongation and from 30-60 Kg/mm2 in tensile strength. Copper layers of good quality are obtained controlling specially the formaldehyde concentration, which governs the plating rate. Mechanism of catalysed reactions and structure of electroless copper layers are given.
| Original language | English |
|---|---|
| Pages (from-to) | 427-430 |
| Journal | Afinidad |
| Volume | 58 |
| Issue number | 496 |
| Publication status | Published - 1 Nov 2001 |
Keywords
- Bath composition
- Electroless copper
- Layers structure
- Physical properties