TY - JOUR
T1 - Compact Modeling Technology for the Simulation of Integrated Circuits Based on Graphene Field-Effect Transistors
AU - Pasadas, Francisco
AU - Feijoo, Pedro C.
AU - Mavredakis, Nikolaos
AU - Pacheco-Sanchez, Aníbal
AU - Chaves, Ferney A.
AU - Jiménez, David
N1 - Publisher Copyright:
© 2022 The Authors. Advanced Materials published by Wiley-VCH GmbH.
PY - 2022/12/1
Y1 - 2022/12/1
N2 - The progress made toward the definition of a modular compact modeling technology for graphene field-effect transistors (GFETs) that enables the electrical analysis of arbitrary GFET-based integrated circuits is reported. A set of primary models embracing the main physical principles defines the ideal GFET response under DC, transient (time domain), AC (frequency domain), and noise (frequency domain) analysis. Another set of secondary models accounts for the GFET non-idealities, such as extrinsic-, short-channel-, trapping/detrapping-, self-heating-, and non-quasi static-effects, which can have a significant impact under static and/or dynamic operation. At both device and circuit levels, significant consistency is demonstrated between the simulation output and experimental data for relevant operating conditions. Additionally, a perspective of the challenges during the scale up of the GFET modeling technology toward higher technology readiness levels while drawing a collaborative scenario among fabrication technology groups, modeling groups, and circuit designers, is provided.
AB - The progress made toward the definition of a modular compact modeling technology for graphene field-effect transistors (GFETs) that enables the electrical analysis of arbitrary GFET-based integrated circuits is reported. A set of primary models embracing the main physical principles defines the ideal GFET response under DC, transient (time domain), AC (frequency domain), and noise (frequency domain) analysis. Another set of secondary models accounts for the GFET non-idealities, such as extrinsic-, short-channel-, trapping/detrapping-, self-heating-, and non-quasi static-effects, which can have a significant impact under static and/or dynamic operation. At both device and circuit levels, significant consistency is demonstrated between the simulation output and experimental data for relevant operating conditions. Additionally, a perspective of the challenges during the scale up of the GFET modeling technology toward higher technology readiness levels while drawing a collaborative scenario among fabrication technology groups, modeling groups, and circuit designers, is provided.
KW - 2D materials
KW - compact modeling
KW - graphene
KW - hybrid integrated circuits
KW - monolithic integrated circuits
KW - radio-frequency
KW - transistors
UR - http://www.scopus.com/inward/record.url?scp=85141492840&partnerID=8YFLogxK
U2 - 10.1002/adma.202201691
DO - 10.1002/adma.202201691
M3 - Review article
C2 - 35593428
AN - SCOPUS:85141492840
SN - 0935-9648
VL - 34
JO - Advanced Materials
JF - Advanced Materials
IS - 48
M1 - 2201691
ER -