A new platform for the fabrication of crystalline micro- and nano-electromechanical systems fully integrable with CMOS is presented. A pre-CMOS process on SOI wafers allows bulk silicon areas for standard CMOS processing and areas with a stack layer of silicon and silicon oxide to be obtained, in which a set of microelectromechanical devices can be fabricated. An integrated resonant beam system with electrical actuation and detection fabricated according to the presented approach is provided.
|Number of pages||2|
|Publication status||Published - 6 Jul 2006|