Channel-hot-carrier degradation of strained MOSFETs: A device level and nanoscale combined approach

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Abstract

© 2015 American Vacuum Society. Strained MOSFETs with SiGe at the source/drain regions and different channel lengths have been studied at the nanoscale with a conductive atomic force microscope (CAFM) and at device level, before and after channel-hot-carrier (CHC) stress. The results show that although strained devices have a larger mobility, they are more sensitive to CHC stress. This effect has been observed to be larger in short channel devices. The higher susceptibility of strained MOSFETs to the stress has been related to a larger density of defects close to the diffusions, as suggested by CAFM data.
Original languageEnglish
Article number022202
JournalJournal of Vacuum Science and Technology B:Nanotechnology and Microelectronics
Volume33
DOIs
Publication statusPublished - 4 Mar 2015

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