All-stencil transistor fabrication on 3D silicon substrates

L. G. Villanueva; O. Vazquez-Mena; C. Martin-Olmos; V. Savu; K. Sidler; J. Montserrat; P. Langlet; C. Hibert; P. Vettiger; J. Bausells; J. Brugger

doi:10.1088/0960-1317/22/9/095022

All-stencil transistor fabrication on 3D silicon substrates

L. G. Villanueva, O. Vazquez-Mena, C. Martin-Olmos, V. Savu, K. Sidler, J. Montserrat, P. Langlet, C. Hibert, P. Vettiger, J. Bausells, J. Brugger

Department of Electronic Engineering

Research output: Contribution to journal › Article › Research › peer-review

7 Citations (Scopus)

Abstract

The standard lithographic techniques to fabricate electronic components involve the use of polymers, baking steps and chemicals. This typically restricts their application to flat substrates made up of standard materials. Stencil lithography has been proposed as a stable alternative to the standard lithographic techniques. In this paper, we demonstrate the completely resistless all-through-stencil fabrication of electronic components, by performing all essential fabrication steps - implantation, etching and metallization - using stencil lithography. This is performed on a planar substrate as well as on pre-patterned 3D substrates, thus showing the potential of this technique for applications in the field of accelerometers, pressure, gas and radiation sensors. © 2012 IOP Publishing Ltd.

Original language	English
Article number	095022
Journal	Journal of Micromechanics and Microengineering
Volume	22
Issue number	9
DOIs	https://doi.org/10.1088/0960-1317/22/9/095022
Publication status	Published - 1 Sep 2012

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title = "All-stencil transistor fabrication on 3D silicon substrates",

abstract = "The standard lithographic techniques to fabricate electronic components involve the use of polymers, baking steps and chemicals. This typically restricts their application to flat substrates made up of standard materials. Stencil lithography has been proposed as a stable alternative to the standard lithographic techniques. In this paper, we demonstrate the completely resistless all-through-stencil fabrication of electronic components, by performing all essential fabrication steps - implantation, etching and metallization - using stencil lithography. This is performed on a planar substrate as well as on pre-patterned 3D substrates, thus showing the potential of this technique for applications in the field of accelerometers, pressure, gas and radiation sensors. {\textcopyright} 2012 IOP Publishing Ltd.",

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All-stencil transistor fabrication on 3D silicon substrates. / Villanueva, L. G.; Vazquez-Mena, O.; Martin-Olmos, C.; Savu, V.; Sidler, K.; Montserrat, J.; Langlet, P.; Hibert, C.; Vettiger, P.; Bausells, J.; Brugger, J.

In: Journal of Micromechanics and Microengineering, Vol. 22, No. 9, 095022, 01.09.2012.

Research output: Contribution to journal › Article › Research › peer-review

TY - JOUR

T1 - All-stencil transistor fabrication on 3D silicon substrates

AU - Villanueva, L. G.

AU - Vazquez-Mena, O.

AU - Martin-Olmos, C.

AU - Savu, V.

AU - Sidler, K.

AU - Montserrat, J.

AU - Langlet, P.

AU - Hibert, C.

AU - Vettiger, P.

AU - Bausells, J.

AU - Brugger, J.

PY - 2012/9/1

Y1 - 2012/9/1

N2 - The standard lithographic techniques to fabricate electronic components involve the use of polymers, baking steps and chemicals. This typically restricts their application to flat substrates made up of standard materials. Stencil lithography has been proposed as a stable alternative to the standard lithographic techniques. In this paper, we demonstrate the completely resistless all-through-stencil fabrication of electronic components, by performing all essential fabrication steps - implantation, etching and metallization - using stencil lithography. This is performed on a planar substrate as well as on pre-patterned 3D substrates, thus showing the potential of this technique for applications in the field of accelerometers, pressure, gas and radiation sensors. © 2012 IOP Publishing Ltd.

AB - The standard lithographic techniques to fabricate electronic components involve the use of polymers, baking steps and chemicals. This typically restricts their application to flat substrates made up of standard materials. Stencil lithography has been proposed as a stable alternative to the standard lithographic techniques. In this paper, we demonstrate the completely resistless all-through-stencil fabrication of electronic components, by performing all essential fabrication steps - implantation, etching and metallization - using stencil lithography. This is performed on a planar substrate as well as on pre-patterned 3D substrates, thus showing the potential of this technique for applications in the field of accelerometers, pressure, gas and radiation sensors. © 2012 IOP Publishing Ltd.

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DO - 10.1088/0960-1317/22/9/095022

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