| Original language | English |
|---|---|
| Pages (from-to) | 179-185 |
| Journal | IEEE trans. compon. packaging manuf. technol., Part A |
| Issue number | 19 |
| Publication status | Published - 1 Jan 1996 |
A Cost Analysis Study for Testability Purposes on Silicon Active Substrate
J. Oliver, H. Kerkhoff
Research output: Contribution to journal › Article › Research