A Cost Analysis Study for Testability Purposes on Silicon Active Substrate

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Original language	English
Pages (from-to)	179-185
Journal	IEEE trans. compon. packaging manuf. technol., Part A
Issue number	19
Publication status	Published - 1 Jan 1996

Cite this

@article{5778e91433974b1c881d9f7a41b3dd32,

title = "A Cost Analysis Study for Testability Purposes on Silicon Active Substrate",

author = "J. Oliver and H. Kerkhoff",

year = "1996",

month = jan,

day = "1",

language = "English",

pages = "179--185",

journal = "IEEE Transactions on Components Packaging and Manufacturing Technology Part A",

issn = "1070-9886",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "19",

}

TY - JOUR

T1 - A Cost Analysis Study for Testability Purposes on Silicon Active Substrate

AU - Oliver, J.

AU - Kerkhoff, H.

PY - 1996/1/1

Y1 - 1996/1/1

M3 - Article

SP - 179

EP - 185

JO - IEEE Transactions on Components Packaging and Manufacturing Technology Part A

JF - IEEE Transactions on Components Packaging and Manufacturing Technology Part A

SN - 1070-9886

IS - 19

ER -