Keyphrases
HfO2
75%
Resistive Switching
45%
Resistive Random Access Memory (ReRAM)
45%
Soft Breakdown
35%
Resistive Switching Device
35%
Memristor
30%
Conduction Characteristics
29%
Ultrathin
29%
Conductance
27%
I-V Characteristics
26%
Post-breakdown
26%
Memdiode
25%
Oxides
24%
Series Resistance
24%
Conductive Filament
22%
Quantum Point Contact
22%
Leakage Current
22%
Current-voltage Characteristics
21%
Electron Transport
21%
Memory Device
20%
Dielectric Breakdown
18%
Ultra-thin Gate Oxide
17%
Electrical Stress
17%
Capacitors
17%
SPICE Model
16%
Breakdown Current
16%
Memristive Devices
16%
Progressive Breakdown
16%
Hard Breakdown
15%
RRAM Devices
15%
Compact Model
15%
Silica
15%
Constriction
14%
Low Resistance State
14%
Gate Stack
13%
Metal-insulator-metal Structure
13%
Temperature Effect
13%
Current-voltage (I-V) Characteristics
13%
Spatial Distribution
13%
Gate Oxide
12%
Breakdown Path
12%
Dielectric Film
12%
SiO2 Film
12%
Constant Voltage Stress
12%
Constant Voltage
12%
Set Voltage
12%
MOS Structure
12%
Aluminum Oxide
11%
Nanolaminates
11%
Mesoscopic
10%
Engineering
Resistive
100%
Current-Voltage Characteristic
59%
Dielectrics
39%
Gate Oxide
32%
Constant Voltage
28%
Resistive Random Access Memory
24%
Metal-Insulator-Metal
23%
Series Resistance
23%
Contact Point
20%
Oxide Layer
19%
Random Access Memory Device
17%
Dielectric Films
17%
Tunnel Construction
16%
Silicon Dioxide
16%
Conductive Filament
16%
SPICE
15%
Semiconductor Structure
13%
Spatial Distribution
11%
Metal Oxide Semiconductor
11%
Failure Event
11%
Contact Model
11%
Power Law Model
11%
Failure Mode
10%
Model Parameter
10%
Metal-Oxide-Semiconductor Field-Effect Transistor
10%
Gate Dielectric
10%
High Resistance State
10%
Oxide Thickness
9%
Parallel Resistance
9%
Gate Stack
9%
Energy Engineering
9%
Characteristic Time
8%
Current Drain
8%
Sio2 Film
8%
Thermal Effect
8%
Experimental Result
8%
Oxide Film
8%
Experimental Observation
8%
Conductive
7%
Reliability Availability and Maintainability (Reliability Engineering)
7%
Temperature Dependence
7%
Energy Dissipation
7%
Memory State
7%
Circuit Simulation
7%
Metal Gate
6%
Equivalent Circuit Model
6%
Gallium Arsenide
6%
Electric Field
6%
Stress Induced Leakage Current
6%
Equivalent Circuit
6%
