Wafer level packaging of silicon pressure sensors

Keyphrases

• Silicone 100%
• Wafer-level Packaging 100%
• Silicon Pressure Sensor 100%
• Deposition Layer 66%
• Photopatternable 66%
• Wafer 33%
• Packaging Technique 33%
• UV Light 33%
• Temperature Effect 33%
• Active Components 33%
• Aspect Ratio 33%
• Silicone Gel 33%
• Wall Structure 33%
• Polymer Layer 33%
• Aggressive Media 33%
• Pressure Sensor 33%
• Wafer Level 33%
• Wire Bonding 33%
• Low Viscosity 33%
• Chrome Mask 33%
• Silicon piezoresistive Pressure Sensor 33%
• Bonding Pad 33%
• Membrane Area 33%
• Soft Silicone 33%
• Pre-packaging 33%
• Silicone Elastomer 33%
• Material Coating 33%
• Resolution Ratio 33%

Engineering

• Level Packaging 100%
• Pressure Sensor 100%
• Elastomer 25%
• Membrane Area 25%
• Bonding Wire 25%
• Active Component 25%
• Coating Material 25%
• Resolution Ratio 25%
• Bonding Pad 25%
• Temperature Dependence 25%
• Aspect Ratio 25%

Material Science

• Polysiloxane 100%
• Silicon 100%
• Novel Device 25%
• Silicone Gel 25%
• Elastomer 25%