Proceedings of the 3rd European Conference on Electronic Packaging Technology: "SUMMIT: Silicon Substrate Multichip Modules for Innovative Products: 3rd European Conference on Electronic Packaging Technology

E. Cabruja; A. Collado; M. Lozano; M. Zabala; J. Santander; J. Cazalla

Proceedings of the 3rd European Conference on Electronic Packaging Technology: "SUMMIT: Silicon Substrate Multichip Modules for Innovative Products: 3rd European Conference on Electronic Packaging Technology

E. Cabruja, A. Collado, M. Lozano, M. Zabala, J. Santander, J. Cazalla

Producció científica: LLibre/informe › Llibre d'Actes › Recerca

Idioma original	Anglès
Lloc de publicació	Nüremberg (DE)
Nombre de pàgines	1
Estat de la publicació	Publicada - de juny 1998

Com citar-ho

@book{24e6cd0700484d198c2882eb6b5dcba3,

title = "Proceedings of the 3rd European Conference on Electronic Packaging Technology: {"}SUMMIT: Silicon Substrate Multichip Modules for Innovative Products: 3rd European Conference on Electronic Packaging Technology",

author = "E. Cabruja and A. Collado and M. Lozano and M. Zabala and J. Santander and J. Cazalla",

year = "1998",

month = jun,

language = "English",

}

TY - BOOK

T1 - Proceedings of the 3rd European Conference on Electronic Packaging Technology: "SUMMIT: Silicon Substrate Multichip Modules for Innovative Products

T2 - 3rd European Conference on Electronic Packaging Technology

AU - Cabruja, E.

AU - Collado, A.

AU - Lozano, M.

AU - Zabala, M.

AU - Santander, J.

AU - Cazalla, J.

PY - 1998/6

Y1 - 1998/6

M3 - Proceeding

BT - Proceedings of the 3rd European Conference on Electronic Packaging Technology: "SUMMIT: Silicon Substrate Multichip Modules for Innovative Products

CY - Nüremberg (DE)

ER -