Integration of RF-MEMS resonators on submicrometric commercial CMOS technologies

J. L. Lopez, J. Verd, J. Teva, G. Murillo, J. Giner, F. Torres, A. Uranga, G. Abadal, N. Barniol

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Resum

Integration of electrostatically driven and capacitively transduced MEMS resonators in commercial CMOS technologies is discussed. A figure of merit to study the performance of different structural layers and different technologies is defined. High frequency (HF) and very high frequency (VHF) resonance MEMS metal resonators are fabricated on a deep submicron 0.18 νm commercial CMOS technology and are characterized using electrical tests without amplification, demonstrating the applicability of the MEMS fabrication process for future technologies. Moreover, the fabricated devices show comparable performance in terms of Q × fres with previously presented MEMS resonators, whereas the small gap allows obtaining a low motional resistance with a single resonator approach. © 2009 IOP Publishing Ltd.
Idioma originalAnglès
Número d’article015002
RevistaJournal of Micromechanics and Microengineering
Volum19
DOIs
Estat de la publicacióPublicada - 25 de març 2009

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