CMOS-SOI platform for monolithic integration of crystalline silicon MEMS

M. Villarroya; E. Figueras; J. Verd; J. Teva; G. Abadal; F. Pérez-Murano; J. Montserrat; A. Uranga; J. Esteve; N. Barniol

doi:10.1049/el:20061097

CMOS-SOI platform for monolithic integration of crystalline silicon MEMS

M. Villarroya, E. Figueras, J. Verd, J. Teva, G. Abadal, F. Pérez-Murano, J. Montserrat, A. Uranga, J. Esteve, N. Barniol

Departament d'Enginyeria Electrònica

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Resum

A new platform for the fabrication of crystalline micro- and nano-electromechanical systems fully integrable with CMOS is presented. A pre-CMOS process on SOI wafers allows bulk silicon areas for standard CMOS processing and areas with a stack layer of silicon and silicon oxide to be obtained, in which a set of microelectromechanical devices can be fabricated. An integrated resonant beam system with electrical actuation and detection fabricated according to the presented approach is provided.

Idioma original	Anglès
Pàgines (de-a)	800-801
Nombre de pàgines	2
Revista	Electronics Letters
Volum	42
Número	14
DOIs	https://doi.org/10.1049/el:20061097
Estat de la publicació	Publicada - 6 de jul. 2006

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10.1049/el:20061097

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title = "CMOS-SOI platform for monolithic integration of crystalline silicon MEMS",

abstract = "A new platform for the fabrication of crystalline micro- and nano-electromechanical systems fully integrable with CMOS is presented. A pre-CMOS process on SOI wafers allows bulk silicon areas for standard CMOS processing and areas with a stack layer of silicon and silicon oxide to be obtained, in which a set of microelectromechanical devices can be fabricated. An integrated resonant beam system with electrical actuation and detection fabricated according to the presented approach is provided.",

author = "M. Villarroya and E. Figueras and J. Verd and J. Teva and G. Abadal and F. P{\'e}rez-Murano and J. Montserrat and A. Uranga and J. Esteve and N. Barniol",

year = "2006",

month = jul,

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doi = "10.1049/el:20061097",

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TY - JOUR

T1 - CMOS-SOI platform for monolithic integration of crystalline silicon MEMS

AU - Villarroya, M.

AU - Figueras, E.

AU - Verd, J.

AU - Teva, J.

AU - Abadal, G.

AU - Pérez-Murano, F.

AU - Montserrat, J.

AU - Uranga, A.

AU - Esteve, J.

AU - Barniol, N.

PY - 2006/7/6

Y1 - 2006/7/6

N2 - A new platform for the fabrication of crystalline micro- and nano-electromechanical systems fully integrable with CMOS is presented. A pre-CMOS process on SOI wafers allows bulk silicon areas for standard CMOS processing and areas with a stack layer of silicon and silicon oxide to be obtained, in which a set of microelectromechanical devices can be fabricated. An integrated resonant beam system with electrical actuation and detection fabricated according to the presented approach is provided.

AB - A new platform for the fabrication of crystalline micro- and nano-electromechanical systems fully integrable with CMOS is presented. A pre-CMOS process on SOI wafers allows bulk silicon areas for standard CMOS processing and areas with a stack layer of silicon and silicon oxide to be obtained, in which a set of microelectromechanical devices can be fabricated. An integrated resonant beam system with electrical actuation and detection fabricated according to the presented approach is provided.

UR - https://www.scopus.com/pages/publications/33745780343

U2 - 10.1049/el:20061097

DO - 10.1049/el:20061097

M3 - Article

SN - 0013-5194

VL - 42

SP - 800

EP - 801

JO - Electronics Letters

JF - Electronics Letters

IS - 14

ER -

CMOS-SOI platform for monolithic integration of crystalline silicon MEMS

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