TY - BOOK
T1 - Challenges and solutions to the defect-centric modeling and circuit simulation of time-dependent variability
AU - Martin-Martinez, Javier
AU - Diaz-Fortuny, Javier
AU - Saraza-Canflanca, Pablo
AU - Rodriguez, Rosana
AU - Castro-Lopez, Rafael
AU - Roca, Elisenda
AU - Fernandez, Francisco V.
AU - Nafria, Montserrat
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - Time-Dependent Variability (TDV) phenomena represent a serious concern for device and circuit reliability. To address the TDV impact at circuit level, Reliability-Aware Design (RAD) tools can be used by circuit designers to achieve more reliable circuits. However, this is not a straightforward task, since the development of RAD tools comprises several steps such as the characterization, modeling and simulation of TDV phenomena. Furthermore, in deeply-scaled CMOS technologies, TDV reveals a stochastic nature that can complicate those steps. In this invited paper, we review some of the main challenges that appear in each step of the flow towards the development of RAD tools, providing our solutions to them.
AB - Time-Dependent Variability (TDV) phenomena represent a serious concern for device and circuit reliability. To address the TDV impact at circuit level, Reliability-Aware Design (RAD) tools can be used by circuit designers to achieve more reliable circuits. However, this is not a straightforward task, since the development of RAD tools comprises several steps such as the characterization, modeling and simulation of TDV phenomena. Furthermore, in deeply-scaled CMOS technologies, TDV reveals a stochastic nature that can complicate those steps. In this invited paper, we review some of the main challenges that appear in each step of the flow towards the development of RAD tools, providing our solutions to them.
KW - aging
KW - array
KW - Bias Temperature Instability (BTI)
KW - characterization
KW - CMOS
KW - degradation
KW - Hot Carrier Injection (HCI)
KW - Random Telegraph Noise (RTN)
KW - reliability
KW - Reliability-Aware Design (RAD)
KW - variability
UR - http://www.scopus.com/inward/record.url?scp=85160451568&partnerID=8YFLogxK
UR - https://www.mendeley.com/catalogue/9f7aa449-14e0-38d5-88a8-7119b87f57d8/
U2 - 10.1109/irps48203.2023.10118334
DO - 10.1109/irps48203.2023.10118334
M3 - Proceeding
AN - SCOPUS:85160451568
SN - 9781665456722
T3 - IEEE International Reliability Physics Symposium Proceedings
BT - Challenges and solutions to the defect-centric modeling and circuit simulation of time-dependent variability
PB - Institute of Electrical and Electronics Engineers Inc.
ER -