A technology for the monolithic fabrication of a pressure sensor and related circuitry

C. Cané, F. Campabadal, J. Esteve, M. Lozano, A. Götz, J. Santander, Ch Burrer, J. A. Plaza, L. Pahun, S. Marco

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Resum

A simple technology for the monolithic fabrication of piezoresistive pressure sensors and signal-conditioning circuitry is presented. The proposed methodology is based on the partition of the complete process into three main blocks: pre-processing steps, related to the sensor structure, standard CMOS technology and post-processing, corresponding to wafer backside etching. The feasibility of the presented technology is demonstrated by the results obtained from the characterization of the sensor devices, circuits and sensor-circuit combination that have been designed, fabricated and tested. In addition, the results obtained from a complete set of technological test structures show no significant effect of the additional processing on the characteristics of the standard CMOS technology. © 1994, All rights reserved.
Idioma originalAnglès
Pàgines (de-a)133-136
Revista"Sensors and Actuators, A: Physical"
Volum46
Número1-3
DOIs
Estat de la publicacióPublicada - 1 de gen. 1995

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