A cost analysis study for testability purposes on silicon active substrates

Joan Oliver, Hans Kerkhoff

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    This paper presents cost analysis results based on yield calculations of test structures placed on the multichip module (MCM) substrates. Calculations are made using yield analysis studies based on the number of defects per area, a critical technological-dependent parameter. The use of MCM's has increased in recent years thanks to their high integration capacity, their greater performance, the capacity to gather different technological integrated circuits (IC's) on the same substrate, and to the reduced substrate areas obtained. These characteristics make the MCM's a powerful integration technology for module development, but the intrinsic construction of the MCM's may cause significant problems when testing has to be performed. Because of this, new cost-effective test methodologies are expected for MCM's that will be built on the MCM substrate. These test structures on the MCM substrate will be integrated if cost-effective solutions are possible. © 1996 IEEE.
    Idioma originalEnglish
    Pàgines (de-a)179-185
    RevistaIEEE Transactions on Components Packaging and Manufacturing Technology Part A
    Estat de la publicacióPublicada - 1 de juny 1996


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