Keyphrases
Acoustic Pressure
6%
Air Condition
8%
Aluminum Scandium Nitride (AlScN)
13%
Array-based
7%
Attogram
7%
Beam Resonators
13%
Cantilever
14%
Circuitry
9%
Clamped Beam
17%
CMOS Circuits
6%
CMOS Integrated
7%
CMOS Process
8%
CMOS Technology
43%
CMOS-MEMS
37%
CMOS-NEMS
7%
Complementary Metal Oxide Semiconductor
35%
Complementary Metal-oxide-semiconductor Technology
12%
Crystalline Silicon
6%
Electrical Characterization
8%
Electrical Detection
7%
Fabrication Methods
8%
Film Bulk Acoustic Resonator
24%
Filter Method
10%
Free-free Beam
7%
Fully Integrated
19%
High Sensitivity
8%
Integrated CMOS
22%
Localized Masses
11%
Mass Sensitivity
6%
Mass Sensor
17%
MEMS Filter
9%
MEMS Oscillator
7%
MEMS Resonator
20%
Metal Layer
9%
Micro-electro-mechanical Systems
17%
Microelectromechanical Systems (MEMS) Resonator
11%
Micromechanics
7%
Monolithically Integrated
28%
Nanoelectromechanical Systems
7%
NEMS Resonator
8%
On chip
18%
Oscillator Circuit
6%
Piezoelectric Micromachined Ultrasonic Transducer (pMUT)
23%
Polysilicon
20%
Resonant Frequency
21%
Resonator
37%
Responsivity
7%
RF MEMS Resonator
10%
Standard CMOS Technology
11%
Tungsten
9%
Engineering
Acoustic Pressure
6%
Air Condition
6%
Amplifier
19%
Bandpass Filter
10%
Capacitive
16%
Complementary Metal-Oxide-Semiconductor
31%
Crystalline Silicon
5%
Echo Pulse
8%
Electrical Impedance
5%
Front End
6%
High Resolution
8%
Integrated System
5%
Metal Layer
6%
Microelectromechanical System
89%
Monolithic Integration
5%
Oscillator
22%
Phase Noise
9%
Piezoelectric
21%
Polysilicon
13%
Q Factor
7%
Readout Circuit
5%
Resonance Frequency
13%
Resonant Frequency
5%
Resonator
100%
Responsivity
8%
Thin Films
24%
Transducer
34%
Ultrasonics
18%
